Samsung says it will be the first to put ASML's newest lithography into high-volume DRAM production, and it is joining the industry push toward larger photomasks.
TSMC also said it intends to start using ASML's High NA machines in high-volume manufacturing in 2030, as the companies seek support from mask makers and chipmakers.
Intel Foundry and ASML said the newest chipmaking lithography tools have processed more than one million wafers and remain in high-volume use for select Panther Lake layers.
