Samsung says it will be the first to put ASML's newest lithography into high-volume DRAM production, and it is joining the industry push toward larger photomasks.
TSMC also said it intends to start using ASML's High NA machines in high-volume manufacturing in 2030, as the companies seek support from mask makers and chipmakers.
The August 11 approval, TSMC's second of roughly $30 billion in three months, funds advanced nodes, packaging, specialty capacity and new fab construction.
TSMC will contribute about ¥282 billion in cash to a Sony-controlled fab in Koshi City, Japan, that aims to start volume production of smartphone sensors in 2029.
Prosecutors say the former TSMC deputy manager copied 21 secret documents to support a planned China venture; TSMC found the copying and recovered the files.
